GD900 thermal conductivity 4.8 W/mK, 1 g in syringe GD900 for computer or laptop processor
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| Brand: | GD |
| Description: | Thermal paste, density: 2.30 g/cm³, operating temperature: -50 °C to 200 °C, thermal conductivity: 4.80 W/m K |
| Maximum operating temperature: | 200°C |
| Minimum operating temperature: | -50°C |
| Density: | 2.3 g/cm³ |
| Thermal conductivity: | 4.8 W/mK |
| Thermal interface type: | Thermal paste |