Description: |
Type: heatsink, purpose: for processor, processor socket: AM2, LGA 1150, LGA 1151, LGA 1151-v2, LGA 1155, LGA 1156, LGA 1200, LGA 1356, LGA 1366, LGA 775, number of fans: passive cooling, Maximum TDP power dissipation: 130W, culé height
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Processor socket: |
AM2, LGA 1150, LGA 1151, LGA 1151-v2, LGA 1155, LGA 1156, LGA 1200, LGA 1356, LGA 1366, LGA 775
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