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| Brand: |
REXANT
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| Description: |
Hot melt adhesive, operating temperature: -60 °C to 300 °C, thermal conductivity: 0.80 W/m K
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| Additional Information: |
Pull-off force: not less than 2.3 MPa, Viscosity: high-viscosity, Thermal conductivity: 0.7–0.8 W/m*K, Operating temperature: –60...+300 °С, Specific volume electrical resistance: not less than 10^14 Ohm*cm, Electrical strength: 2-5 kV/mm
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| Maximum operating temperature: |
300°C
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| Minimum operating temperature: |
-60°C
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| Thermal conductivity: |
0.8 W/mK
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| Thermal interface type: |
Hot glue
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