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| Brand: |
Intel
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| Description: |
Socket: LGA2011, Processor line: Intel Xeon, Cores: 4, Manufacturing process: 22 nm, Processor frequency: 3700 MHz, Memory type: DDR3, Core: Ivy Bridge-EP 2013, L3 cache size: 10 MB, TDP: 130 W
|
| Additional Information: |
Core voltage 0.65-1.30V; memory frequency 800/1066/1333/1600/1866
|
| Maximum operating temperature: |
70°C
|
| Core: |
Ivy Bridge-EP 2013
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| Process technology: |
22 nm
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| Memory type: |
DDR3
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| Socket: |
LGA2011
|
| Number of cores: |
4
|
| Maximum Memory: |
256 GB
|
| Clock frequency: |
3700 MHz
|
| L2 cache size: |
1 MB
|
| L3 cache size: |
10 MB
|
| Built-in memory controller: |
Yes, bandwidth 59.7 GB/s
|
| Maximum frequency with Turbo Boost: |
3900 MHz
|
| Maximum number of memory channels: |
4
|
| Core voltage: |
0.65 B
|
| Max. number of PCI Express lanes: |
40
|
| Technology and security: |
Intel vPro support
|
| Typical heat dissipation: |
130 W
|
| L1 cache size: |
256 KB
|